Jack M. KAPLAN
MBA, Baruch City University of New York, 1974 BS, University of Colorado,1970
Visiting Professor, IMADEC University, International School of Business, Vienna, A Professor of Entrepreneurship, Columbia Business School, NY, USA Visiting Professor, Penn. State University, State College Pa. USA Visiting Professor, Catolica University Lisbon, Portugal
He has been a faculty member of executive development programs on marketing innovation, product development and entrepreneurship courses at Columbia Business School, Penn. State University and fortune 1000 companies.
Main Academic Interests:
Marketing Innovation and Entrepreneurship New Product Development Entrepreneurship and Management
Non-academic Positions held:
He was President of Datamark Technologies, Inc., an entrepreneurial business venture engaged in loyalty and stored-value marketing programs. He has extensive experience in new product technology innovation, software, communications and stored value and loyalty programs for the retail, financial and software industries. During his career, Mr. Kaplan started and managed three successful companies, raised capital in excess of 12 million dollars from companies, venture capital and wealthy angel individuals. Recently, Ceridian a fortune 500company acquired the company for cash. Mr. Kaplan’s professional seminar experience includes conducting courses for Fortune 500 companies. The list includes MIT Enterprise Forum, Aetna Insurance Company, Panasonic Global Sales Group, and Johnson & Johnson in New Product Strategies for managers to operate their business units more effectively. He is also national and regional judge for the Ernst & Young Entrepreneur Of The Year® Award
Selected and Recent Publications:
He is the author of “Patterns of Entrepreneurship” 3rd Edition, used as a college textbook published by John Wiley and Sons in April 2009 and “Getting Started in Entrepreneurship”. John Wiley and Sons in April 2003 His previous book, “Smart Cards: The Global Information Passport,” and articles have appeared in Technology News, Crain’s of New York MIT Enterprise Forum.
Homepage: Columbia University
eMail: Jk697@columbia.edu
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